Title:
THERMOGRAPHY TEST METHOD AND APPARATUS FOR EVALUATING A BOND INTERFACE OF A SPUTTERING TARGET/BACKING PLATE ASSEMBLY
Document Type and Number:
WIPO Patent Application WO2005026404
Kind Code:
A3
Abstract:
A method and apparatus for thermographically evaluating the bond integrity of a sputtering target assembly is described. The method includes applying a heating or cooling medium or energy to one surface of the assembly and acquiring a graphic recording of a corresponding temperature change on the opposing surface of the assembly using an imaging device. Also described is a method of mathematically analyzing the pixel data recorded in each frame to produce an integrated normalized temperature map that represents the bond integrity of the assembly.
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Inventors:
WICKERSHAM CHARLES E (US)
ZHANG ZHIGUO (US)
ELLISON LARRY EDWIN (US)
KACHALOV MIKHAIL Y (US)
WHITE JOHN (US)
ZHANG ZHIGUO (US)
ELLISON LARRY EDWIN (US)
KACHALOV MIKHAIL Y (US)
WHITE JOHN (US)
Application Number:
PCT/US2004/022402
Publication Date:
August 18, 2005
Filing Date:
July 14, 2004
Export Citation:
Assignee:
CABOT CORP (US)
WICKERSHAM CHARLES E (US)
ZHANG ZHIGUO (US)
ELLISON LARRY EDWIN (US)
KACHALOV MIKHAIL Y (US)
WHITE JOHN (US)
WICKERSHAM CHARLES E (US)
ZHANG ZHIGUO (US)
ELLISON LARRY EDWIN (US)
KACHALOV MIKHAIL Y (US)
WHITE JOHN (US)
International Classes:
C23C14/34; G01J5/00; G01K1/16; G01N25/72; G06T7/00; H01J37/34; (IPC1-7): G06T7/00; C23C14/34; G01J5/00; G01N25/72; H01J37/34
Domestic Patent References:
| WO2002099157A1 | 2002-12-12 | |||
| WO2002037089A1 | 2002-05-10 | |||
| WO2001041421A2 | 2001-06-07 | |||
| WO2002089042A1 | 2002-11-07 |
Foreign References:
| DE19832833A1 | 2000-02-10 | |||
| US20030055594A1 | 2003-03-20 | |||
| US5631465A | 1997-05-20 | |||
| US6092427A | 2000-07-25 |
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