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Patent Searching and Data


Title:
THERMOPLASTIC ELASTOMER RESIN COMPOSITION AND COMPOSITE MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2013/137370
Kind Code:
A1
Abstract:
The present invention provides a thermoplastic elastomer resin composition having high bonding strength for bonding different materials such as resins, metals and glass; having excellent moldability in injection molding etc., and mechanical properties; having high thermal conductivity; and being industrially advantageous in manufacturing. The present invention further provides a composite molded body in which the thermoplastic elastomer resin composition is used as a material for bonding different materials. The present invention pertains to a thermoplastic polyester elastomer resin composition characterized in that the main constituents are a hard segment (a1) comprising mainly crystalline aromatic polyester units, and a soft segment (a2) comprising mainly aliphatic polyether units and/or aliphatic polyester units; and further characterized by comprising 30 to 85 vol% of a polyester block copolymer composition (X) with a Shore D hardness of not more than 53D, and 15 to 70 vol% of a thermally conductive filler (D).

Inventors:
SAKAI HIDETOSHI (JP)
YAMADA YOSUKE (JP)
UEMURA YUJI (JP)
Application Number:
PCT/JP2013/057117
Publication Date:
September 19, 2013
Filing Date:
March 14, 2013
Export Citation:
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Assignee:
TORAY DU PONT KK (JP)
International Classes:
C08L67/00; B32B27/36; C08K3/00; C08K5/54; C08L29/04; C08L29/14; C08L71/02
Foreign References:
JP2004206889A2004-07-22
JPS63270865A1988-11-08
JP2004002791A2004-01-08
JP2000176050A2000-06-27
JP2003285873A2003-10-07
Attorney, Agent or Firm:
IWATANI, Ryo (JP)
Tatsu Iwatani (JP)
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