Title:
THERMOPLASTIC MOLDING COMPOUNDS
Document Type and Number:
WIPO Patent Application WO2000077092
Kind Code:
A3
Abstract:
The invention relates to thermoplastic molding compounds that contain (Co) polymers and graft polymers and 0.1 to 8 wt.- % of a combination of at least 3 components selected from the compounds (I), (II), (III) and (IV). (I) is a compound with at least one structural unit (a) wherein M = metal and n = valency of the metal M. Compound (II) is a compound with at least one structural unit (b) and compound (III) is a compound with at least one structural unit (c). Compound (IV) represents a compound that contains none of the structural units comprised by compounds (I) to (III).
Inventors:
EICHENAUER HERBERT (DE)
LEITZ EDGAR (DE)
LEITZ EDGAR (DE)
Application Number:
PCT/EP2000/004934
Publication Date:
March 14, 2002
Filing Date:
May 30, 2000
Export Citation:
Assignee:
BAYER AG (DE)
EICHENAUER HERBERT (DE)
LEITZ EDGAR (DE)
EICHENAUER HERBERT (DE)
LEITZ EDGAR (DE)
International Classes:
C08J5/00; C08K5/01; C08K5/09; C08K5/098; C08K5/10; C08K5/20; C08L25/02; C08L25/12; C08L33/12; C08L33/20; C08L35/00; C08L51/04; C08L91/00; C08L55/02; (IPC1-7): C08L25/12; C08K5/098; C08K5/101; C08K5/103; C08K5/20
Foreign References:
| EP0845496A2 | 1998-06-03 | |||
| DE2827594B1 | 1979-10-25 | |||
| DE4117308A1 | 1992-12-03 | |||
| US4310449A | 1982-01-12 | |||
| US4500665A | 1985-02-19 |
Other References:
DATABASE WPI Section Ch Week 199940, Derwent World Patents Index; Class A18, AN 1999-474175, XP002149635
DATABASE WPI Section Ch Week 197720, Derwent World Patents Index; Class A13, AN 1977-35114Y, XP002149636
DATABASE WPI Section Ch Week 197720, Derwent World Patents Index; Class A13, AN 1977-35114Y, XP002149636
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