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Title:
THERMOPLASTIC POLYMER COMPOSITION AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2012/014757
Kind Code:
A1
Abstract:
Provided is a thermoplastic polymer composition which has excellent flexibility, mechanical properties, and molding processability, can adhere to a ceramic, a metal, or a synthetic resin without performing a primer treatment or the like, and has high adhesiveness even if exposed to a high-temperature environment, and also provided is a molded article obtained using the thermoplastic polymer composition. Specifically, provided is a thermoplastic polymer composition comprising: 100 parts by mass of (A) a thermoplastic elastomer which is a block copolymer having a polymer block containing an aromatic vinyl compound unit and a polymer block containing a conjugated diene compound unit or a hydrogenated product thereof; 1 to 100 parts by mass of (B) a polyvinyl acetal resin having a glass transition temperature of 80 to 130ºC; and 0.1 to 300 parts by mass of (C) a softener.

Inventors:
MINAMIDE ASAKO (JP)
MASUDA MIKIO (JP)
Application Number:
PCT/JP2011/066492
Publication Date:
February 02, 2012
Filing Date:
July 20, 2011
Export Citation:
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Assignee:
KURARAY CO (JP)
MINAMIDE ASAKO (JP)
MASUDA MIKIO (JP)
International Classes:
C08L53/02; C08L29/14; C09J11/06; C09J129/14; C09J151/00; C09J153/02
Domestic Patent References:
WO2009081877A12009-07-02
WO2005063876A12005-07-14
Foreign References:
JP2003268193A2003-09-25
JP2004059635A2004-02-26
JP2004059636A2004-02-26
Other References:
See also references of EP 2599833A4
Attorney, Agent or Firm:
OHTANI, Tamotsu (JP)
Tamotsu Otani (JP)
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Claims: