THERMOPLASTIC RESIN COMPOSITION CONTAINING CLAY COMPOSITE AND PROCESS FOR PREPARING THE SAME

Title:

THERMOPLASTIC RESIN COMPOSITION CONTAINING CLAY COMPOSITE AND PROCESS FOR PREPARING THE SAME

Document Type and Number:

WIPO Patent Application WO/1997/043343

Kind Code:

A1

Abstract:

A thermoplastic resin composition comprising a thermoplastic resin and a clay composite, wherein the clay composite is one prepared by introducing a predetermined silane compound into a swellable silicate. The clay composite is prepared by increasing the bottom spacing of the swellable silicate and then introducing the silane compound. It is dispersed in the form of a number of very small layers, separately from one another, in the resin of the thermoplatic resin composition. Therefore, the thermoplastic resin composition has excellent mechanical properties, heat resistance, and surface appearance in the form of a molding.

Inventors:

SUZUKI NORIYUKI (JP)
OOHARA YOUICHI (JP)

Application Number:

PCT/JP1997/001605

Publication Date:

November 20, 1997

Filing Date:

May 13, 1997

Export Citation:

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Assignee:

KANEKA CORP (JP)
SUZUKI NORIYUKI (JP)
OHARA YOUICHI (JP)

International Classes:

C08K9/06; (IPC1-7): C08L101/00; C08K3/00; C08L67/00; C08L69/00

Foreign References:

JPH05194851A	1993-08-03
JPH06322249A	1994-11-22
JPH08269321A	1996-10-15

Other References: