THERMOPLASTIC RESIN COMPOSITION AND CURABLE COMPOSITION

Title:

THERMOPLASTIC RESIN COMPOSITION AND CURABLE COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2017/199499

Kind Code:

A1

Abstract:

A resin composition (10) as this thermoplastic resin composition includes a polyamide-imide resin (11) and nanodiamond particles (12). The 10% thermal decomposition temperature of the nanodiamond particles (12) is, for example, 400°C or higher. Such a thermoplastic resin composition is suitable for realizing high heat resistance. This curable composition includes a polyamide-imide resin (11), nanodiamond particles (12), and a solvent. Such a curable composition is appropriate for being able to obtain a thermoplastic resin composition suitable for realizing high heat resistance.

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Inventors:

KUME ATSUSHI (JP)
UMEMOTO KOUICHI (JP)
ITO HISAYOSHI (JP)

Application Number:

PCT/JP2017/006215

Publication Date:

November 23, 2017

Filing Date:

February 20, 2017

Export Citation:

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Assignee:

DAICEL CORP (JP)

International Classes:

C08L79/08; C08K3/04

Foreign References:

JP2012201878A	2012-10-22
JP2008101189A	2008-05-01

Attorney, Agent or Firm:

GOTO & CO. (JP)

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