Title:
THERMOPLASTIC RESIN COMPOSITION AND HOT-MELT ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2020/050225
Kind Code:
A1
Abstract:
This thermoplastic resin composition includes: a base polymer including a propylene-based polymer (A) having an absorbed heat of fusion (ΔH-D) of 0 J/g-60 J/g and having a melting point (Tm-D) that is not observed or of 0°C-120°C; and a propylene-based polymer (C) having an absorbed heat of fusion (ΔH-D) of 20 J/g-120 J/g and having a melting point (Tm-D) that exceeds 120°C. The content of the propylene-based polymer (C) with respect to the content of the propylene-based polymer (A) which is 100 parts by mass, is 0.5-100 parts by mass.
Inventors:
FUJII NOZOMU (JP)
KANAMARU MASAMI (JP)
KOGA ASAMI (JP)
KANAMARU MASAMI (JP)
KOGA ASAMI (JP)
Application Number:
PCT/JP2019/034463
Publication Date:
March 12, 2020
Filing Date:
September 02, 2019
Export Citation:
Assignee:
IDEMITSU KOSAN CO (JP)
International Classes:
C08L23/10; C08L23/04; C08L91/00; C08L91/06; C09J11/06; C09J123/04; C09J123/10; C09J191/06
Domestic Patent References:
| WO2014069606A1 | 2014-05-08 | |||
| WO2014192767A1 | 2014-12-04 |
Foreign References:
| JP2017095685A | 2017-06-01 | |||
| JP2012153765A | 2012-08-16 | |||
| JP2016102162A | 2016-06-02 | |||
| JP2016155916A | 2016-09-01 | |||
| JPH04236287A | 1992-08-25 | |||
| JP2013064056A | 2013-04-11 | |||
| JP2016524002A | 2016-08-12 |
Other References:
See also references of EP 3848413A4
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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