THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE

Title:

THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE

Document Type and Number:

WIPO Patent Application WO/2014/175332

Kind Code:

A1

Abstract:

[Problem] To improve the hand touch feeling of a thermoplastic resin composition that has an enhanced rigidity and reduce squeak noise generation by using a filler such as glass fiber therein. [Solution] A thermoplastic resin composition that comprises rubber-reinforced aromatic vinyl-based resins (A, B), a crystalline thermoplastic resin (C) and a fibrous or layered filler (D), characterized in that the melting point of the thermoplastic resin composition is present in the temperature ranges of 0-100°C and 170-280°C, said melting point being measured in accordance with JIS K 7121-1987, and the flexural modulus thereof is 3,000 MPa or greater. It is preferred that the component (A) contains an ethylene/α-olefin-based rubber polymer (a1) having a melting point that is measured in accordance with JIS K 7121-1987 of 0-100°C. It is preferred that the component (C) has a melting point that is measured in accordance with JIS K 7121-1987 of 170-280°C. Also, it is preferred that the component (C) comprises at least one member selected from the group consisting of polyester-based resins and polyamide-based resins.

Inventors:

MOCHIZUKI ISAMU (JP)
EGAWA KAZUYA (JP)

Application Number:

PCT/JP2014/061431

Publication Date:

October 30, 2014

Filing Date:

April 23, 2014

Export Citation:

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Assignee:

TECHNO POLYMER CO LTD (JP)

International Classes:

C08L51/04; C08K7/00; C08L25/04; C08L101/00

Foreign References:

JP2005307180A	2005-11-04
JPH06128471A	1994-05-10
JPH08259771A	1996-10-08
JPH08259772A	1996-10-08
JP2004123823A	2004-04-22
JP2009179675A	2009-08-13
JP2008516062A	2008-05-15
JPH073095A	1995-01-06
JP2001234040A	2001-08-28

Other References: