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Patent Searching and Data


Title:
THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE THEREOF
Document Type and Number:
WIPO Patent Application WO/2018/083975
Kind Code:
A1
Abstract:
Provided are: a thermoplastic resin composition which has an excellent balance of mechanical properties, heat resistance, fluidity, and dimensional stability, and has excellent residence stability when molded as well as excellent molded article external appearance and coatability; and a molded article of the thermoplastic resin composition. The present invention comprises: a polycarbonate resin (I); a graft copolymer (II) comprising a graft copolymer (II-1) which is a monomer mixture including an aromatic vinyl monomer and a vinyl cyanide monomer that has been graft polymerized under the presence of a diene rubbery polymer, or a graft copolymer (II-2) which is a monomer mixture including an aromatic vinyl monomer and a vinyl cyanide monomer that has been graft polymerized under the presence of an acrylic rubbery polymer; a vinyl copolymer (III) formed by copolymerizing an aromatic vinyl monomer and a vinyl cyanide monomer; a crystalline resin (IV); and a plate-shaped inorganic filler (V). When the total amount of (I)+(II)+(III)+(IV)+(V) is 100 weight%, (I) is 50 to 70 weight%, (II) is 3 to 15 weight%, (III) is 10 to 25 weight%, (IV) is 1 to 9 weight%, and (V) is 10 to 20 weight%, and the content of (IV) relative to 100 weight% of (V) is greater than or equal to 10 weight% and less than 50 weight%.

Inventors:
UEDA TAKASHI (JP)
KOBAYASHI MASANORI (JP)
SATO DAISUKE (JP)
YAMASHITA TARO (JP)
Application Number:
PCT/JP2017/037546
Publication Date:
May 11, 2018
Filing Date:
October 17, 2017
Export Citation:
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Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08L69/00; C08K3/00; C08K3/34; C08L25/12; C08L55/02; C08L67/02
Foreign References:
JP2015131876A2015-07-23
JP2002275367A2002-09-25
JP2000080263A2000-03-21
JP2011219553A2011-11-04
JP2015145479A2015-08-13
Other References:
See also references of EP 3536746A4
Attorney, Agent or Firm:
SEIRYU PATENT PROFESSIONAL CORPORATION et al. (JP)
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