Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE THEREOF
Document Type and Number:
WIPO Patent Application WO/2019/151504
Kind Code:
A1
Abstract:
The present invention provides a resin composition which is excellent in terms of moist heat resistance, thermal stability, rigidity, sheet impact resistance, and chemical resistance. The resin composition of the present invention comprises: 100 parts by weight of the sum of (A) 30-99 parts by weight of one or more resins (A component) comprising 10-100 wt% polycarbonate/polydiorganosiloxane copolymer resin (A1 component) and 0-90 wt% aromatic polycarbonate resin (A2 component) and (B) 1-70 parts by weight of a polyester resin (B component); and (C) 10-50 parts by weight of a filler (C component) surface-treated with a silane coupling agent having an alkyl group. The resin composition has a rubbery-polymer content of 3 parts by weight or less per 100 parts by weight of the sum of the A and B components.

Inventors:
BABA, Ozora (2-4 Nakanoshima 3-chome, Kita-ku, Osaka-sh, Osaka 05, 〒5300005, JP)
Application Number:
JP2019/003730
Publication Date:
August 08, 2019
Filing Date:
February 01, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TEIJIN LIMITED (2-4 Nakanoshima 3-chome, Kita-ku Osaka-sh, Osaka 05, 〒5300005, JP)
International Classes:
C08L69/00; C08G63/85; C08K9/06; C08L67/00
Foreign References:
JP2013018864A2013-01-31
JP2007277382A2007-10-25
JP2007262369A2007-10-11
JPH01318051A1989-12-22
Attorney, Agent or Firm:
AOKI, Atsushi et al. (SEIWA PATENT & LAW, Toranomon 37 Mori Bldg. 5-1, Toranomon 3-chome, Minato-k, Tokyo 23, 〒1058423, JP)
Download PDF: