Title:
THERMOPLASTIC RESIN COMPOSITION, AND MOLDED ARTICLE OBTAINED BY MOLDING SAME
Document Type and Number:
WIPO Patent Application WO/2019/155982
Kind Code:
A1
Abstract:
This thermoplastic resin composition comprises a semi-aromatic polyamide (A) and a polyphenylene ether (B), and is characterized in that: the semi-aromatic polyamide (A) contains an aromatic dicarboxylic acid component and a diamine component, where the primary component of the aromatic dicarboxylic acid component is terephthalic acid, and the primary component of the diamine component is 1,10-decanediamine, 1,11-undecanediamine, or 1,12-dodecanediamine; the molar ratio (A/B) between the semi-aromatic polyamide (A) and the polyphenylene ether (B) is 15/85 to 85/15; the melting point of the thermoplastic resin composition is 290˚C or above; and the difference between the melting point and the crystallization temperature of the thermoplastic resin composition is no more than 30˚C.
Inventors:
MII JUNICHI (JP)
SAIJO TAKEHITO (JP)
SAIJO TAKEHITO (JP)
Application Number:
PCT/JP2019/003425
Publication Date:
August 15, 2019
Filing Date:
January 31, 2019
Export Citation:
Assignee:
UNITIKA LTD (JP)
International Classes:
C08L77/06; C08L71/12
Foreign References:
| JP2006002005A | 2006-01-05 | |||
| JP2017500418A | 2017-01-05 | |||
| US5504158A | 1996-04-02 | |||
| CN106609034A | 2017-05-03 |
Attorney, Agent or Firm:
MORIMOTO INT'L PATENT OFFICE (JP)
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