Title:
THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE USING SAME
Document Type and Number:
WIPO Patent Application WO/2023/095445
Kind Code:
A1
Abstract:
The present invention relates to a thermoplastic resin composition that includes 100 parts by mass of a vinyl copolymer (I) that has a refractive index of 1.50–2.00, 2–3 parts by mass of inorganic particles (II-1) that have a particle diameter (D50) of 1.2–2.8 μm, and 1–7 parts by mass of inorganic particles (II-2) that have a particle diameter (D50) of 3.6–6.4 μm, there being a total of 4–10 parts by mass of the inorganic particles, and the ratio (II-2)/(II-1) of inorganic particles (II-2) to inorganic particles (II-1) being at least 0.3 but less than 4.0.
Inventors:
UEDA TAKASHI (JP)
SATO DAISUKE (JP)
TAKASAKI TADAKATSU (JP)
SATO DAISUKE (JP)
TAKASAKI TADAKATSU (JP)
Application Number:
PCT/JP2022/036713
Publication Date:
June 01, 2023
Filing Date:
September 30, 2022
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08L57/00; C08K3/013; C08K3/30
Foreign References:
| JP2000239407A | 2000-09-05 | |||
| JPH09306217A | 1997-11-28 | |||
| JPS57162743A | 1982-10-06 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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