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Patent Searching and Data


Title:
THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE FORMED THEREFROM
Document Type and Number:
WIPO Patent Application WO/2023/277506
Kind Code:
A1
Abstract:
A thermoplastic resin composition of the present invention comprises: approximately 100 parts by weight of a polycarbonate resin; approximately 20-80 parts by weight of a polyphenylene ether resin; approximately 15-70 parts by weight of glass fiber; approximately 1-10 parts by weight of epoxy-modified polystyrene; approximately 1-20 parts by weight of a styrene-ethylene/butylene-styrene copolymer; and approximately 0.2-4 parts by weight of dihydro-9-oxa-10- phosphaphenanthrene-10-oxide (DOPO), wherein the weight ratio of the epoxy-modified polystyrene and the styrene-ethylene/butylene-styrene copolymer is approximately 1 : 0.5 to 1 : 10. The thermoplastic resin composition has excellent impact resistance, flowability, appearance characteristics and the like, and has low dielectric constant, dielectric loss and the like.

Inventors:
LEE SANG HWA (KR)
PARK CHAN MOO (KR)
JANG CHEOL HOON (KR)
LEE BONG JAE (KR)
Application Number:
PCT/KR2022/009194
Publication Date:
January 05, 2023
Filing Date:
June 28, 2022
Export Citation:
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Assignee:
LOTTE CHEMICAL CORP (KR)
International Classes:
C08L69/00; C08J5/04; C08J5/10; C08K5/5313; C08K7/14; C08L25/08; C08L71/12
Foreign References:
KR20180136559A2018-12-24
JP2012224754A2012-11-15
KR20140014372A2014-02-06
KR20150078277A2015-07-08
KR20080061813A2008-07-03
Attorney, Agent or Firm:
AJU INTERNATIONAL LAW & PATENT GROUP (KR)
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