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Title:
THERMOPLASTIC RESIN COMPOSITION, MOLDED ARTICLE AND PRODUCT
Document Type and Number:
WIPO Patent Application WO/2023/281602
Kind Code:
A1
Abstract:
A thermoplastic resin composition which contains: a thermoplastic resin (A) that is selected from the group consisting of an aromatic polycarbonate resin (A1), a styrene resin (A2), an aromatic polyester resin (A3), a polyphenylene ether resin (A4), a methacrylic resin (A5), a polyarylene sulfide resin (A6), an olefin resin (A7), a polyamide resin (A8) and a mixture of these resins; a hydrophilic copolymer (B) that has an oxyethylene group; and a fatty acid metal salt (C) that is represented by formula (1). With respect to this thermoplastic resin composition, the hydrophilic copolymer (B) is obtained by bonding a plurality of alternating copolymers (a) of a polyester (a1) and a hydrophilic polymer (a2) having an oxyethylene group to each other by the intermediary of an ester bond with at least one compound that is selected from the group consisting of a polyhydric alcohol compound (b1) having three or more hydroxyl groups, an epoxy compound (b2) having two or more epoxy groups, and a polycarboxylic acid compound (b3). (1): M(OH)y(R-COO)x (In formula (1), R represents an alkyl group having 6 to 40 carbon atoms or an alkenyl group; M represents at least one metal element that is selected from the group consisting of aluminum, zinc, calcium, magnesium, lithium and barium; and each of x and y independently represents an integer of 0 or more, while satisfying the relational expression (x + y) = (valence of M).)

Inventors:
MORIOKA REIJI (JP)
Application Number:
PCT/JP2021/025355
Publication Date:
January 12, 2023
Filing Date:
July 05, 2021
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
C08K5/098; C08L71/02; C08L101/00
Domestic Patent References:
WO2014115745A12014-07-31
WO2021006192A12021-01-14
WO2006100844A12006-09-28
Foreign References:
JP2017128676A2017-07-27
JP2004217931A2004-08-05
JP2006265533A2006-10-05
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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