Title:
THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLES
Document Type and Number:
WIPO Patent Application WO/2002/094936
Kind Code:
A1
Abstract:
A thermoplastic resin composition which gives a molded piece having good surface appearance even when extruded at a high extrusion rate, keeps impact resistance even after heat exposure, and is little contaminated during the production. Namely, a composition comprising a polyamide, a polyphenylene ether and a block copolymer, wherein the block copolymer is a mixture of a block copolymer having a number−average molecular weight of less than 120,000 and a block copolymer having a number−average molecular weight of 120,000 or above.
Inventors:
NAKAGAWA MATSUYOSHI (JP)
MIYOSHI TAKAAKI (JP)
NODA KAZUYA (JP)
MIYOSHI TAKAAKI (JP)
NODA KAZUYA (JP)
Application Number:
PCT/JP2002/004913
Publication Date:
November 28, 2002
Filing Date:
May 21, 2002
Export Citation:
Assignee:
ASAHI CHEMICAL IND (JP)
NAKAGAWA MATSUYOSHI (JP)
MIYOSHI TAKAAKI (JP)
NODA KAZUYA (JP)
NAKAGAWA MATSUYOSHI (JP)
MIYOSHI TAKAAKI (JP)
NODA KAZUYA (JP)
International Classes:
C08K3/04; C08L53/00; C08L53/02; C08L55/02; C08L71/12; C08L77/00; (IPC1-7): C08L77/00; C08L71/12; C08K5/42; C08J5/00
Foreign References:
| JPH08217972A | 1996-08-27 | |||
| JPS6479258A | 1989-03-24 | |||
| JPH07179747A | 1995-07-18 | |||
| JPH06157895A | 1994-06-07 |
Attorney, Agent or Firm:
Asamura, Kiyoshi (New Ohtemachi Bldg. 2-1, Ohtemachi 2-chom, Chiyoda-ku Tokyo, JP)
Download PDF: