Title:
THERMOPLASTIC RESIN COMPOSITION, MOLDED BODY THEREOF AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2006/043641
Kind Code:
A1
Abstract:
Disclosed is a thermoplastic resin composition which is excellent in rigidity, impact strength, heat resistance and heat dissipation properties. This thermoplastic resin composition can be easily injection molded into heat dissipating members or casings for heat-generating electronic components. Also disclosed are a molded body and a method for producing a molded body. Specifically disclosed is a thermoplastic resin composition containing a thermoplastic resin and a filler which has a melt mass flow rate of 1.5-200 g/10 min. This thermoplastic resin composition is characterized in that a molded body made therefrom has a thermal conductivity of 0.4-1.5 W/mK and a bending modulus of 1000-8000 MPa. Also disclosed is a method for producing a molded body which is characterized by forming a molded body by injection molding the thermoplastic resin composition. Further disclosed is a molded body for heat dissipating members which is obtained by molding the thermoplastic resin composition.
Inventors:
SHIMIZU KOUICHI (JP)
TSUKADA MASASHI (JP)
TAKAHASHI JUN (JP)
TSUKADA MASASHI (JP)
TAKAHASHI JUN (JP)
Application Number:
PCT/JP2005/019324
Publication Date:
April 27, 2006
Filing Date:
October 20, 2005
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KK (JP)
SHIMIZU KOUICHI (JP)
TSUKADA MASASHI (JP)
TAKAHASHI JUN (JP)
SHIMIZU KOUICHI (JP)
TSUKADA MASASHI (JP)
TAKAHASHI JUN (JP)
International Classes:
C08L101/12; C08J5/00; C08K3/22; C08K7/18; C09K5/08; H01L23/373; H05K7/20
Foreign References:
| JP2003187757A | 2003-07-04 | |||
| JP2002146187A | 2002-05-22 | |||
| JP2002003830A | 2002-01-09 |
Attorney, Agent or Firm:
Senmyo, Kenji (38 Kanda-Higashimatsushitach, Chiyoda-ku Tokyo 42, JP)
Download PDF:
Previous Patent: MESOPOROUS THIN-MEMBRANE AND PROCESS FOR PRODUCING THE SAME
Next Patent: FLUID REACTOR
Next Patent: FLUID REACTOR