Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
THERMOPLASTIC RESIN COMPOSITION AND THERMOPLASTIC RESIN MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2019/003531
Kind Code:
A1
Abstract:
Provided is a thermoplastic resin composition comprising (A) a rubber-containing polymer and (B) a phosphorus antioxidant having an alkyl group having 8 or more carbon atoms, wherein the thermoplastic resin composition has a gel content of 40 mass% or more. The thermoplastic resin composition has a melt flow rate (M1) at a holding time of 4 minutes of 20 [g/10 min] or more measured at a temperature of 280°C under a load of 49 N according to JIS K7210. The thermoplastic resin composition has high fluidity and thermal stability during molding even though it has a high gel content, is easy to handle, and can be stably produced.

Inventors:
SATOU YOSHIAKI (JP)
Application Number:
PCT/JP2018/012804
Publication Date:
January 03, 2019
Filing Date:
March 28, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08L21/00; C08J5/18; C08K5/13; C08K5/49; C08L51/04; C08L101/00
Domestic Patent References:
WO1997028950A11997-08-14
Foreign References:
JP2005163003A2005-06-23
JP2006299038A2006-11-02
JP2006143785A2006-06-08
JP2002241574A2002-08-28
JPH09263614A1997-10-07
JPS61815U1986-01-07
JP2006088081A2006-04-06
JP2007254727A2007-10-04
JP2007262399A2007-10-11
JP2010017948A2010-01-28
JPS6219309B21987-04-27
JPS638983B21988-02-25
JPH08323934A1996-12-10
JPH11147237A1999-06-02
JP2002080678A2002-03-19
JP2002080679A2002-03-19
JP2005097351A2005-04-14
JP2004137298A2004-05-13
JP2005163003A2005-06-23
JP2005139416A2005-06-02
JP2008106252A2008-05-08
JP2006342358A2006-12-21
JP2808251B21998-10-08
Other References:
See also references of EP 3647353A4
Attorney, Agent or Firm:
TANAKA Shinichiro et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: DRIVING ASSISTANCE APPARATUS

Next Patent: AIR-CONDITIONING DEVICE