Title:
THERMOPLASTIC RESIN COMPOSITION, MOLDED BODY, AND CONSTITUTING MEMBER OF IC SOCKET FOR INSPECTION
Document Type and Number:
WIPO Patent Application WO/2024/004602
Kind Code:
A1
Abstract:
This thermoplastic resin composition contains component (A), which is at least one thermoplastic resin selected from the group consisting of (a1) a crystalline thermoplastic resin having a melting point of 270°C or more and (a2) an amorphous thermoplastic resin having a glass transition temperature of 200°C or more, and component (B), which is an inorganic filler including (b1) zirconium oxide, wherein the content of the component (b1) based on 100 parts by mass of the component (A) is 2-40 parts by mass, and the content of the component (B) based on 100 parts by mass of the component (A) is 2-60 parts by mass.
Inventors:
SATO YUUKI (JP)
Application Number:
PCT/JP2023/021667
Publication Date:
January 04, 2024
Filing Date:
June 12, 2023
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08L101/00; C08K3/013; C08K3/22; C08L79/08
Domestic Patent References:
| WO2017175679A1 | 2017-10-12 |
Foreign References:
| JP2016075894A | 2016-05-12 | |||
| JP2018053156A | 2018-04-05 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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