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Patent Searching and Data


Title:
THERMOPLASTIC RESIN COMPOSITION AND MOLDED PRODUCT COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2013/100347
Kind Code:
A1
Abstract:
Provided are a thermoplastic resin composition comprising: a base resin comprising a polyarylene ether-based resin and a polyolefin-based resin; an inorganic filler having a decomposition temperature of about 200 ℃ or higher; and a dispersant comprising a salt represented by chemical formula 1, wherein the content of the polyolefin-based resin (weight, WOL) and the content of the polyarylene ether-based resin (weight, WAR) satisfy the relation represented by WAR≤1.9×WOL, and a molded product comprising the same.

Inventors:
CHO JIN-KYUNG (KR)
CHANG DO-HOON (KR)
KIM DOO-YOUNG (KR)
HONG CHANG-MIN (KR)
Application Number:
PCT/KR2012/009095
Publication Date:
July 04, 2013
Filing Date:
November 01, 2012
Export Citation:
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Assignee:
CHEIL IND INC (KR)
International Classes:
C08L71/12; C08J5/00; C08K3/00; C08L23/00
Foreign References:
JP2009522408A2009-06-11
KR20060123440A2006-12-01
KR20080079666A2008-09-01
JP2010540716A2010-12-24
KR20100017356A2010-02-16
Attorney, Agent or Firm:
PANKOREA PATENT AND LAW FIRM (KR)
팬코리아특허법인 (KR)
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Claims: