THERMOPLASTIC RESIN COMPOSITION, RESIN MOLDED PRODUCT, HEAT-DISSIPATING MATERIAL AND HEAT-DISSIPATING MEMBER

Title:

THERMOPLASTIC RESIN COMPOSITION, RESIN MOLDED PRODUCT, HEAT-DISSIPATING MATERIAL AND HEAT-DISSIPATING MEMBER

Document Type and Number:

WIPO Patent Application WO/2018/056350

Kind Code:

A1

Abstract:

The present invention provides a resin composition which contains a thermoplastic resin (A) and spinel particles (B), wherein the spinel particles (B) contain magnesium atoms, aluminum atoms, oxygen atoms and molybdenum, and the crystallite diameter of the [111] plane is 220 nm or more. The present invention also provides: a resin molded product that contains the thermoplastic resin composition; a heat-dissipating material characterized by containing the thermoplastic resin composition; and a heat-dissipating member characterized by containing the resin molded product.

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Inventors:

KANEMATSU TAKAYUKI (JP)
MAEKAWA FUMIHIKO (JP)
HAYASHI MASAMICHI (JP)
OSHIO ATSUSHI (JP)
OKI HIRONOBU (JP)
ITOYA KAZUO (JP)
IIDA MASAKI (JP)
YUAN JIAN-JUN (JP)
KINOSHITA HIROSHI (JP)

Application Number:

PCT/JP2017/034065

Publication Date:

March 29, 2018

Filing Date:

September 21, 2017

Export Citation:

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Assignee:

DAINIPPON INK & CHEMICALS (JP)

International Classes:

C08L101/00; C01G39/00; C08K3/22

Foreign References:

JP6061173B1	2017-01-18
JP5995130B1	2016-09-21
JP2010514173A	2010-04-30

Attorney, Agent or Firm:

KONO Michihiro (JP)

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