Title:
THERMOPLASTIC RESIN COMPOSITION FOR REFLECTIVE MATERIAL, REFLECTIVE PLATE, AND LIGHT-EMITTING DIODE ELEMENT
Document Type and Number:
WIPO Patent Application WO/2013/018360
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a thermoplastic resin composition for a reflective material which has excellent molded product mechanical strength, represented especially by toughness, excellent heat resistance, high reflectance, and excellent moldability, and which makes it possible to obtain a reflective plate with little decline in reflectance caused by heating such as in the steps for producing an LED or in a reflow soldering step. A first embodiment of this thermoplastic resin composition for a reflective material includes: 30 to 85 mass% of a polyester resin (A) that has a melting point or glass transition temperature of 250°C or higher and includes an alicyclic hydrocarbon structure; 0.1 to 15 mass% of a thermoplastic resin (B) that has a polyolefin backbone and a functional group structure; 5 to 50 mass% of a white pigment (C); and 10 to 50 mass% of an inorganic filler (D); the thermoplastic resin (B) either including 0.1 to 1.8 wt% of a functional group structure unit (B1) that further includes a heteroatom, or further including an aromatic hydrocarbon structure (B2), and the limiting viscosity [η] being 0.04 to 1.0 dl/g.
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Inventors:
OGASAWARA HIDETO
HAMA TAKASHI
KAWABE KUNIAKI
KANAYA HIROTAKA
TAKIZAWA NOBUHIRO
AMANO AKINORI
EBATA HIROKI
KOMIYA KAN
HAMA TAKASHI
KAWABE KUNIAKI
KANAYA HIROTAKA
TAKIZAWA NOBUHIRO
AMANO AKINORI
EBATA HIROKI
KOMIYA KAN
Application Number:
PCT/JP2012/004872
Publication Date:
February 07, 2013
Filing Date:
July 31, 2012
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
OGASAWARA HIDETO
HAMA TAKASHI
KAWABE KUNIAKI
KANAYA HIROTAKA
TAKIZAWA NOBUHIRO
AMANO AKINORI
EBATA HIROKI
KOMIYA KAN
OGASAWARA HIDETO
HAMA TAKASHI
KAWABE KUNIAKI
KANAYA HIROTAKA
TAKIZAWA NOBUHIRO
AMANO AKINORI
EBATA HIROKI
KOMIYA KAN
International Classes:
C08L67/02; C08K3/00; C08K3/22; C08L51/06; G02B5/08
Domestic Patent References:
WO2001053369A1 | 2001-07-26 | |||
WO2001027124A1 | 2001-04-19 |
Foreign References:
JP2009507990A | 2009-02-26 | |||
JPH07242810A | 1995-09-19 | |||
JPH04142362A | 1992-05-15 | |||
JPH03223340A | 1991-10-02 | |||
JP4245716B2 | 2009-04-02 | |||
JP4117130B2 | 2008-07-16 | |||
JP2008182172A | 2008-08-07 | |||
JP2009507990A | 2009-02-26 | |||
JPS5763310A | 1982-04-16 | |||
JPS5883006A | 1983-05-18 | |||
JPH03706A | 1991-01-07 | |||
JP3476793B2 | 2003-12-10 | |||
JPH04218508A | 1992-08-10 | |||
JP2003105022A | 2003-04-09 | |||
JPH03193796A | 1991-08-23 | |||
JPH0241303A | 1990-02-09 |
Other References:
See also references of EP 2740766A4
Attorney, Agent or Firm:
WASHIDA, KIMIHITO (JP)
Koichi Washida (JP)
Koichi Washida (JP)
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Claims: