THERMOPLASTIC RESIN COMPOSITION - SUMITOMO CHEMICAL CO

Title:

THERMOPLASTIC RESIN COMPOSITION

Document Type and Number:

WIPO Patent Application WO/1991/019762

Kind Code:

A1

Abstract:

A thermoplastic resin composition comprising: 100 parts by weight of a composition composed of 95 to 5 % by weight of at least one polyolefin resin (A) selected from the group consisting of homopolymers and copolymers of ethylene or an alpha-olefin and products of modification thereof with a polyfunctional compound (E) or an unsaturated monomer (L) and 5 to 95 % by weight of at least one polyphenylene ether resin (B) selected from the group consisting of polyphenylene ether, products of modification thereof with the compound (E) or the monomer (L), and compositions comprising the same and an aromatic vinyl polymer resin (M), and 0.001 to 10 parts by weigth of a dinitro diamine (D) of general formula (I), wherein X represents a divalent open-chain aliphatic, cycloaliphatic or aromatic group which may contain halogen or oxygen therein; R' represents hydrogen or an open-chain aliphatic, cycloaliphatic or aromatic group provided that two nitrogen atoms may be bound to each other through X and R1 to form a ring R1 when both of X and R1 are open-chain aliphatic groups; and R2 and R3 represent each independently hydrogen or an alkyl group having 1 to 12 carbon atoms, or R2 and R3 may be combined together to form a ring.

Inventors:

ABE HIROOMI (JP)
FUJII TAKESHI (JP)
YAMAMOTO MASASHI (JP)
YACHIGO SHINICHI (JP)
NAGASAKI HIDEO (JP)
INUI NAOKI (JP)

Application Number:

PCT/JP1990/000759

Publication Date:

December 26, 1991

Filing Date:

June 11, 1990

Export Citation:

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Assignee:

SUMITOMO CHEMICAL CO (JP)

International Classes:

C08K5/32; C08K5/34; C08L21/00; C08L23/00; C08L23/04; C08L25/00; C08L51/06; C08L71/12; (IPC1-7): C08K5/32; C08L21/00; C08L23/00; C08L25/00; C08L51/06; C08L71/12

Foreign References:

JPS6153355A

1986-03-17

Other References: