Title:
THERMOPLASTIC RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO2010110077
Kind Code:
A1
Abstract:
Provided is a thermoplastic resin composition which comprises a polyamide resin matrix and a modified rubber that exhibits excellent low temperature endurance and that is incorporated and dispersed in the polyamide resin matrix for the purpose of improving the low temperature endurance (fatigue endurance in term of repeated deformation). The thermoplastic resin can retain the fluidity and thus form a film even when the content of the modified rubber is high, and exhibits excellent low temperature endurance. The thermoplastic resin composition is a composition which comprises (A) a polyamide resin and (B) a modified rubber having an acid anhydride group or an epoxy group and which is characterized in that the modified rubber (B) is modified with a compound (C) capable of forming a hydrogen bond, said compound (C) having both a functional group reactive with either an acid anhydride group or an epoxy group, and a functional group capable of binding to either an amide bond or a hydroxyl group by a hydrogen bond. Further, it is preferable that the polyamide resin (A) is a polyamide resin modified with a compound capable of binding to the terminal amino group of the polyamide resin. The thermoplastic resin composition is suitable for use in producing tires, hoses, and so on.
Inventors:
MOROOKA NAOYUKI (JP)
Application Number:
PCT/JP2010/054065
Publication Date:
September 30, 2010
Filing Date:
March 04, 2010
Export Citation:
Assignee:
YOKOHAMA RUBBER CO LTD (JP)
MOROOKA NAOYUKI (JP)
MOROOKA NAOYUKI (JP)
International Classes:
C08L77/00; B32B25/08; B32B27/34; B60C1/00; B60C5/14; C08L15/00; C08L29/02; F16L11/04
Domestic Patent References:
| WO2007083785A1 | 2007-07-26 | |||
| WO2007043497A1 | 2007-04-19 |
Foreign References:
| JP2007291301A | 2007-11-08 | |||
| JP2008133437A | 2008-06-12 | |||
| JP2008260887A | 2008-10-30 | |||
| JPH11240108A | 1999-09-07 | |||
| JPS55157650A | 1980-12-08 | |||
| JP2009057524A | 2009-03-19 | |||
| JP2002080644A | 2002-03-19 | |||
| JP2007326896A | 2007-12-20 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
Atsushi Aoki (JP)
Atsushi Aoki (JP)
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