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Patent Searching and Data


Title:
THERMOPLASTIC RESIN FILM LAMINATE AND MOLDED ARTICLE COMPRISING THERMOPLASTIC RESIN FILM LAMINATE
Document Type and Number:
WIPO Patent Application WO/2016/152974
Kind Code:
A1
Abstract:
Provided is a thermoplastic resin film laminate which is obtained by ultrasonic welding of a thermoplastic resin film and a thermoplastic resin molded article, and which has high welding strength and excellent appearance with less welding marks. The above-described problem is solved by a thermoplastic resin film laminate which is obtained by bonding, by ultrasonic welding, a thermoplastic resin film (A) having a thickness of 0.4 mm or less and a welding margin (C) of a thermoplastic resin molded article (B) having the welding margin (C) and having a thickness of 0.5 mm or more, and wherein the height of the welding margin (C) is 75-125% of the thickness of the thermoplastic resin film (A).

Inventors:
KUROKAWA HARUHIKO (JP)
Application Number:
PCT/JP2016/059387
Publication Date:
September 29, 2016
Filing Date:
March 24, 2016
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
MGC FILSHEET CO LTD (JP)
International Classes:
B32B27/00; B29C65/08; B32B3/06
Domestic Patent References:
WO2013069490A12013-05-16
Foreign References:
JP2007253508A2007-10-04
Attorney, Agent or Firm:
KOBAYASHI Hiroshi et al. (JP)
Kobayashi 浩 (JP)
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