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Patent Searching and Data


Title:
THERMOPLASTIC RESIN FILM AND METHOD FOR PRODUCING THERMOPLASTIC RESIN FILM
Document Type and Number:
WIPO Patent Application WO/2018/159424
Kind Code:
A1
Abstract:
The present invention pertains to a thermoplastic resin film in which: the ratio Er30 at 30°C of the elastic modulus ETD in a film width direction orthogonal to a film transport direction relative to the elastic modulus EMD in the film transport direction is 1.1-1.8; and the difference between a maximum value Ermax and a minimum value Ermin selected from the ratio Er30 at 30°C, the ratio Er90 at 90°C, the ratio Er120 at 120°C, the ratio Er150 at 150°C, and the ratio Er180 at 180°C, of the elastic modulus ETD relative to the elastic modulus EMD, is 0.7 or less. The present invention also pertains to a method for producing the thermoplastic resin film.

Inventors:
HAMADA YASUHIRO (JP)
Application Number:
PCT/JP2018/006316
Publication Date:
September 07, 2018
Filing Date:
February 21, 2018
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
B29C55/14; B29C48/08; B29C48/305; C08J5/18; B29L7/00
Foreign References:
JP2014219429A2014-11-20
JP2011154360A2011-08-11
JP2014189002A2014-10-06
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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