Title:
THERMOPLASTIC RESIN FOAM FILM AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2014/017528
Kind Code:
A1
Abstract:
A thermoplastic resin foam film which is substantially formed of a thermoplastic resin that is specifically a poly(meth)acrylimide resin, and which has a density of 30-500 kg/m3, an average cell diameter of 2-500 μm and a thickness of 0.05-1.0 mm. This thermoplastic resin foam film is capable of providing a thermoplastic resin foam film that has high heat resistance, light weight, thin thickness and good compression resistance. This thermoplastic resin foam film is also capable of providing a multilayer foam film having high rigidity by lamination with an aluminum foil or the like.
Inventors:
NODA KOJI (JP)
Application Number:
PCT/JP2013/070018
Publication Date:
January 30, 2014
Filing Date:
July 24, 2013
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
C08J9/00; B32B15/082; H04R7/02; H04R7/06
Domestic Patent References:
| WO2010047274A1 | 2010-04-29 |
Foreign References:
| JP2007513213A | 2007-05-24 | |||
| JPH0570618A | 1993-03-23 | |||
| JP2012010268A | 2012-01-12 |
Attorney, Agent or Firm:
YANAGINO Takao et al. (JP)
Takao Yanagino (JP)
Takao Yanagino (JP)
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