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Patent Searching and Data


Title:
THERMOPLASTIC RESIN PROCESSING AID, AND THERMOPLASTIC RESIN COMPOSITION CONTAINING SAME
Document Type and Number:
WIPO Patent Application WO/2012/036173
Kind Code:
A1
Abstract:
[Problem] To provide a thermoplastic resin processing aid that can effectively increase molding/processing properties of a thermoplastic resin or a composition containing same without detracting from the intrinsic properties of the thermoplastic resin. [Solution] The processing aid for being combined with a thermoplastic resin is characterized by (1) the processing aid containing a copolymer (A) obtained by copolymerizing a) 50-95 wt% of an aromatic vinyl monomer, b) 5-50 wt% of a vinyl cyanide monomer, and d) 0-45 wt% of another vinyl monomer that can copolymerize with the aromatic vinyl monomer and the vinyl cyanide monomer (however, the total of the monomers used in the copolymer (A) is 100 wt%), (2) the peak molecular weight (Mp) of the copolymer (A) being at least one million, and (3) the copolymer being a particulate, wherein 1-50 wt% of particles with a particle size of at least 355 µm are contained in every 100 wt% of the copolymer (A).

Inventors:
SAITO TAKASHI (JP)
ITO MASANORI (JP)
TAMAI SEIJI (JP)
Application Number:
PCT/JP2011/070907
Publication Date:
March 22, 2012
Filing Date:
September 13, 2011
Export Citation:
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Assignee:
NIPPON A & L INC (JP)
SAITO TAKASHI (JP)
ITO MASANORI (JP)
TAMAI SEIJI (JP)
International Classes:
C08F212/10; C08L25/04; C08L25/12; C08L27/06
Foreign References:
JP2000026543A2000-01-25
JPH1171433A1999-03-16
JPH10168131A1998-06-23
JPH10330425A1998-12-15
JP2001031826A2001-02-06
Attorney, Agent or Firm:
FUJII, ATSUSHI (JP)
Fujii 淳 (JP)
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Claims: