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Patent Searching and Data


Title:
THERMOPLASTIC RESIN WITH HIGH THERMAL CONDUCTIVITY
Document Type and Number:
WIPO Patent Application WO/2011/132389
Kind Code:
A1
Abstract:
Disclosed is a thermoplastic resin which can greatly increase thermal conductive ratio in a resin composition when said composition comprises thermally conductive filler, and which is capable of being injection moulded even in multipurpose injection moulding moulds. The thermoplastic resin is characterised in that a principal chain is mainly formed by repeated specified units, and 60 mol% or more of molecular chain ends are a carboxyl group.

Inventors:
YOSHIHARA SHUSUKE (JP)
EZAKI TOSHIAKI (JP)
MATSUMOTO KAZUAKI (JP)
Application Number:
PCT/JP2011/002208
Publication Date:
October 27, 2011
Filing Date:
April 14, 2011
Export Citation:
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Assignee:
KANEKA CORP (JP)
YOSHIHARA SHUSUKE (JP)
EZAKI TOSHIAKI (JP)
MATSUMOTO KAZUAKI (JP)
International Classes:
C08G63/00; C08G63/68; C08K3/00; C08K3/28; C08K13/04; C08L67/00; C08G63/185; C08G63/685
Domestic Patent References:
WO2010050202A12010-05-06
WO2011033815A12011-03-24
WO2002094905A12002-11-28
WO2006120993A12006-11-16
Foreign References:
JP2009091440A2009-04-30
JP2010037474A2010-02-18
JPH06298928A1994-10-25
JP2011063790A2011-03-31
JP2011084714A2011-04-28
JP2011084715A2011-04-28
JP2011084716A2011-04-28
JP2007224060A2007-09-06
JP2008150525A2008-07-03
JPS6040127A1985-03-02
Other References:
J. ASRAR ET AL.: "The preparation and properties of polymers based on 4,4'- dihydroxybiphenyl", JOURNAL OF POLYMER SCIENCE: POLYMER PHYSICS EDITION, vol. 21, no. 7, 1983, pages 1119 - 1131, XP008158115
See also references of EP 2562200A4
MACROMOLECULES, vol. 17, 1984, pages 2288
POLYMER, vol. 24, 1983, pages 1299
EUR.POLYM.J., vol. 16, 1980, pages 303
MOL.CRYST.LIQ.CRYST., vol. 88, 1982, pages 295
Attorney, Agent or Firm:
KANEKA CORPORATION (JP)
KANEKA Co. (JP)
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Claims: