THERMOSETTING ADHESIVE COMPOSITION, THERMOSETTING ADHESIVE SHEET, METHOD FOR PRODUCING SAME, AND REINFORCED FLEXIBLE PRINTED WIRING BOARD

Title:

THERMOSETTING ADHESIVE COMPOSITION, THERMOSETTING ADHESIVE SHEET, METHOD FOR PRODUCING SAME, AND REINFORCED FLEXIBLE PRINTED WIRING BOARD

Document Type and Number:

WIPO Patent Application WO/2011/043119

Kind Code:

A1

Abstract:

Disclosed is a thermosetting adhesive composition comprising (A) an acrylic copolymer, (B) an epoxy resin, and (C) an epoxy resin curing agent. The acrylic copolymer (A) is obtained by copolymerizing 65 to 75% by mass of (a) a (meth)acrylic ester monomer containing no epoxy group, 20 to 35% by mass of (b) an acrylonitrile monomer, and 1 to 10% by mass of (c) a (meth)acrylic ester monomer containing an epoxy group. The epoxy resin curing agent comprises particles of an organic acid dihydrazide having an average particle diameter of 0.5 to 15 μm.

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Inventors:

NATORI TOSHIKI (JP)

Application Number:

PCT/JP2010/062492

Publication Date:

April 14, 2011

Filing Date:

July 26, 2010

Export Citation:

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Assignee:

SONY CHEM & INF DEVICE CORP (JP)
NATORI TOSHIKI (JP)

International Classes:

C09J133/04; C08G59/50; C08L33/18; C08L63/00; C09J7/35; C09J11/06; C09J133/08; C09J163/00; C09J163/10

Foreign References:

JP2004238634A	2004-08-26
JPH01113476A	1989-05-02
JPH11293092A	1999-10-26
JP2005089629A	2005-04-07

Attorney, Agent or Firm:

TAJIME & TAJIME (JP)
Patent business corporation Tajime international patent firm (JP)

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