Title:
THERMOSETTING ADHESIVE FILM AND COVERLAY FILM COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2022/164171
Kind Code:
A1
Abstract:
The present invention relates to a thermosetting adhesive film and a coverlay film comprising same, and more specifically, to a thermosetting adhesive film which has excellent ion migration resistance while having a low dielectric permittivity, as well as excellent peel-off strength, and to a coverlay film comprising the thermosetting adhesive film.
Inventors:
AN JIN MAN (KR)
Application Number:
PCT/KR2022/001291
Publication Date:
August 04, 2022
Filing Date:
January 25, 2022
Export Citation:
Assignee:
HANWHA SOLUTIONS CORP (KR)
International Classes:
C09J7/30; C08L13/00; C09J7/40; C09J11/04; C09J163/00; C09K21/04; H05K3/28
Foreign References:
| KR20080030933A | 2008-04-07 | |||
| KR101577686B1 | 2015-12-29 | |||
| JP2011506669A | 2011-03-03 | |||
| KR20150088437A | 2015-08-03 | |||
| KR20110128863A | 2011-11-30 | |||
| KR102342147B1 | 2021-12-21 |
Attorney, Agent or Firm:
ERUUM & LEEON INTELLECTUAL PROPERTY LAW FIRM (KR)
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