Title:
THERMOSETTING COMPOSITION AND COATED SUBSTRATE HAVING CURED FILM COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2020/246194
Kind Code:
A1
Abstract:
[Problem] To provide: a thermosetting composition for a surface coating of a high-melting-point substrate, said composition being capable of solving the problem of peeling of a coating film that has been applied to the high-melting-point substrate; and a coated substrate obtained by applying a surface coating layer comprising the thermosetting composition to the high-melting-point substrate. [Solution] A thermosetting composition to be applied to a high-melting-point substrate having a melting point of not less than 270°C, said thermosetting composition comprising, (A) a thermosetting component, (B) aluminum oxide particles, and (C) acrylic block copolymers represented by formula (I) or formula (II) below. (I) X–Y–X or (II) X–Y–X' (In the formulas, X and X' are polymer blocks primarily comprising methacrylic acid ester units having a glass transition point Tg of at least 0°C, and Y is a polymer block primarily comprising acrylic acrylic acid ester units having a glass transition point of less than 0°C.) The mass percentage of the sum of X and X' with respect to the total mass of the acrylic block copolymers is in the range of 12 mass% to 35 mass%, inclusive. Furthermore, a coated substrate obtained by applying a cured film comprising the thermosetting composition to the high-melting-point substrate.
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Inventors:
DAIGO YOSHIKAZU (JP)
OHTANI TOMOKO (JP)
OHTANI TOMOKO (JP)
Application Number:
PCT/JP2020/018418
Publication Date:
December 10, 2020
Filing Date:
May 01, 2020
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
B32B27/20; B32B7/027; B32B27/30; C08K3/22; C08L101/00; C09D7/61; C09D7/65; C09D201/00
Domestic Patent References:
| WO2016132564A1 | 2016-08-25 |
Foreign References:
| JP2013095839A | 2013-05-20 | |||
| JP2019041097A | 2019-03-14 | |||
| JP2005317371A | 2005-11-10 | |||
| JP2018160636A | 2018-10-11 | |||
| JP2007317945A | 2007-12-06 |
Attorney, Agent or Firm:
ETOH Toshiaki (JP)
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