Title:
THERMOSETTING COMPOSITION FOR OPTICAL SEMICONDUCTOR, DIE BOND MATERIAL FOR OPTICAL SEMICONDUCTOR DEVICE, UNDERFILL MATERIAL FOR OPTICAL SEMICONDUCTOR DEVICE, SEALING AGENT FOR OPTICAL SEMICONDUCTOR DEVICE, AND OPTICAL SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2007/125956
Kind Code:
A1
Abstract:
Disclosed is a thermosetting composition for optical semiconductors which
is high in transparency and excellent in heat resistance, light resistance and
adhesion to housing materials and the like, while being free from film thinning
or discoloration due to heat generation or light emission of a light-emitting
device. Also disclosed are a sealing agent for optical semiconductor devices
and a die bond material for optical semiconductor devices each using such a thermosetting
composition, and an optical semiconductor device obtained by using the thermosetting
composition for optical semiconductors, the sealing agent for optical semiconductor
devices, the die bond material for optical semiconductor devices and/or an underfill
material for optical semiconductor devices. Specifically disclosed is a thermosetting
composition for optical semiconductors, which contains a silicone resin having
a cyclic ether-containing group, and a heat curing agent reactive with the cyclic
ether-containing group. The silicone resin mainly contains a structural unit
represented by the general formula (1) below and a structural unit represented
by the general formula (2) below. When the total number of the structural units
contained in the silicone resin is taken as 1, the content of the structural unit
represented by the general formula (1) is 0.6-0.95 (on a molar basis) and the content
of the structural unit represented by the general formula (2) is 0.05-0.4 (on
a molar basis). In addition, the thermosetting composition for optical semiconductors
contains 5-40% by mole of the cyclic ether-containing group. [chemical formula
1] (R1R2SiO2/2) (1) [chemical formula
2] (R3SiO3/2) (2)
Inventors:
TANIKAWA MITSURU (JP)
WATANABE TAKASHI (JP)
NISHIMURA TAKASHI (JP)
WATANABE TAKASHI (JP)
NISHIMURA TAKASHI (JP)
Application Number:
PCT/JP2007/058948
Publication Date:
November 08, 2007
Filing Date:
April 25, 2007
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
TANIKAWA MITSURU (JP)
WATANABE TAKASHI (JP)
NISHIMURA TAKASHI (JP)
TANIKAWA MITSURU (JP)
WATANABE TAKASHI (JP)
NISHIMURA TAKASHI (JP)
International Classes:
C08G59/32; C08G77/14; C08L83/06; H01L21/52; H01L23/29; H01L23/31; H01L33/56
Foreign References:
| JP2007106798A | 2007-04-26 | |||
| JP2007131782A | 2007-05-31 | |||
| JP2006008747A | 2006-01-12 | |||
| JPH1095835A | 1998-04-14 | |||
| JPH09310024A | 1997-12-02 | |||
| JP2006104293A | 2006-04-20 | |||
| JP2006104249A | 2006-04-20 | |||
| JP2006306953A | 2006-11-09 | |||
| JP2003277473A | 2003-10-02 | |||
| JP2002314142A | 2002-10-25 | |||
| JP2004155865A | 2004-06-03 |
Attorney, Agent or Firm:
YASUTOMI, Yasuo et al. (5-36 Miyahara 3-chome,Yodogawa-ku, Osaka-shi, Osaka 03, JP)
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