Title:
THERMOSETTING COMPOSITION, RESIN SHEET, METAL FOIL PROVIDED WITH RESIN, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2019/026927
Kind Code:
A1
Abstract:
The present disclosure provides a thermosetting composition the cured product of which can have a low dielectric constant, a low dielectric loss tangent, high heat resistance, and high adhesiveness to resins. The thermosetting composition according to the present disclosure contains an ethylene-propylene-diene copolymer (A) and an inorganic filler (B) that has been surface-treated by a surface treatment agent having a polymerizable unsaturated bond.
Inventors:
AOKI KOUICHI
Application Number:
PCT/JP2018/028730
Publication Date:
February 07, 2019
Filing Date:
July 31, 2018
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08L23/16; B32B15/08; C08K9/04; H05K1/03; H05K3/46
Domestic Patent References:
| WO2014038534A1 | 2014-03-13 |
Foreign References:
| JP2007099957A | 2007-04-19 | |||
| JP2005239997A | 2005-09-08 | |||
| JP2013018847A | 2013-01-31 | |||
| JPH10218886A | 1998-08-18 | |||
| JP2011095731A | 2011-05-12 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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