Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
THERMOSETTING COMPOSITION, RESIN SHEET, METAL FOIL PROVIDED WITH RESIN, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2019/026927
Kind Code:
A1
Abstract:
The present disclosure provides a thermosetting composition the cured product of which can have a low dielectric constant, a low dielectric loss tangent, high heat resistance, and high adhesiveness to resins. The thermosetting composition according to the present disclosure contains an ethylene-propylene-diene copolymer (A) and an inorganic filler (B) that has been surface-treated by a surface treatment agent having a polymerizable unsaturated bond.

Inventors:
AOKI, Kouichi
Application Number:
JP2018/028730
Publication Date:
February 07, 2019
Filing Date:
July 31, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (1-61, Shiromi 2-chome Chuo-ku, Osaka-sh, Osaka 07, 〒5406207, JP)
International Classes:
C08L23/16; B32B15/08; C08K9/04; H05K1/03; H05K3/46
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (Umeda Square Bldg, 9F. 1-12-17, Umeda, Kita-ku, Osaka-sh, Osaka 01, 〒5300001, JP)
Download PDF: