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Patent Searching and Data


Title:
THERMOSETTING COMPOSITION FOR UNDERFILL AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/163900
Kind Code:
A1
Abstract:
The objective of the present invention is to provide a thermosetting composition for underfill for providing a seal between a substrate and a semiconductor chip which is mounted on the substrate in a facing-down manner, the composition being capable of improving high-frequency characteristics of a semiconductor device. The thermosetting composition for underfill contains a bi- or less-functional acrylic compound, a thermal radical polymerization initiator, silica, and a 1,2-vinyl group-containing elastomer; has a liquid phase; and is made, by thermal curing, into a cured product having a relative permittivity of 3.2 or less at 25°C and a dielectric loss tangent of 0.013 or less at 25°C.

Inventors:
YAMATSU SHIGERU
KANAGAWA NAOKI
Application Number:
PCT/JP2018/007139
Publication Date:
September 13, 2018
Filing Date:
February 27, 2018
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08F20/20; C08K3/36; H01L21/60; H01L23/29; H01L23/31
Foreign References:
JP2015052035A2015-03-19
JP2015017169A2015-01-29
JP2015078303A2015-04-23
JP2002194057A2002-07-10
JP2015503220A2015-01-29
JP2001068604A2001-03-16
JP2017179186A2017-10-05
JP2017171793A2017-09-28
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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