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Patent Searching and Data


Title:
THERMOSETTING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/030339
Kind Code:
A1
Abstract:
Provided is a thermosetting composition configured such that a cured product obtained therefrom has no problems with deformation or coloration and furthermore has exceptional mechanical properties such as hardness and bending properties. This thermosetting composition contains a component (A), a component (B), and a component (D) and, optionally, a component (C), and moreover contains 20-60 wt% of component (A), 40-80 wt% of component (B), and 0-40 wt% of component (C) in a total of 100 wt% of components (A)-(C), and contains 20-60 mol% of methacryloyl groups in a total of 100 mol% of ethylenic unsaturated groups contained in components (A)-(C). Component (A): a compound having an isocyanurate ring and having two or more (meth)acryloyl groups; component (B): a compound other than component (A) that has two or more (meth)acryloyl groups; component (C): a compound having one ethylenic unsaturated group; component (D): a thermal polymerization initiator.

Inventors:
KAMIMURA HIROYUKI (JP)
OKAZAKI EIICHI (JP)
Application Number:
PCT/JP2017/028583
Publication Date:
February 15, 2018
Filing Date:
August 07, 2017
Export Citation:
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Assignee:
TOAGOSEI CO LTD (JP)
International Classes:
C08F220/34; C08J5/18
Domestic Patent References:
WO2013129345A12013-09-06
Foreign References:
JPS60149633A1985-08-07
JP2012031361A2012-02-16
JP2017078139A2017-04-27
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