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Patent Searching and Data


Title:
THERMOSETTING COMPOUND
Document Type and Number:
WIPO Patent Application WO/2017/169738
Kind Code:
A1
Abstract:
Provided is a thermosetting compound which has good solvent solubility, and can be quickly cured by a thermal treatment to form a cured product having ultra-high resistance to heat. The thermosetting compound according to the present invention is represented by formula (1). In formula (1): R1 and R2 each represent a thermosetting group; D1 and D2 are the same or different from each other and each represent a single bond or a linking group; Ar1, Ar2, and Ar3 are the same or different from each other and each represent a divalent aromatic hydrocarbon group, or a divalent group in which two or more aromatic hydrocarbons are bonded together through a single bond, a divalent aliphatic hydrocarbon group, or a divalent alicyclic hydrocarbon group; and E represents an ester bond.

Inventors:
NAKATANI, Kouji (1239 Shinzaike, Aboshi-ku, Himeji-sh, Hyogo 83, 〒6711283, JP)
INOUE, Keizo (1239 Shinzaike, Aboshi-ku, Himeji-sh, Hyogo 83, 〒6711283, JP)
Application Number:
JP2017/010175
Publication Date:
October 05, 2017
Filing Date:
March 14, 2017
Export Citation:
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Assignee:
DAICEL CORPORATION (3-1 Ofuka-cho, Kita-ku Osaka-sh, Osaka 11, 〒5300011, JP)
International Classes:
C08F22/40; H01L21/56; H01L23/29; H01L23/31
Domestic Patent References:
WO2009144955A12009-12-03
Foreign References:
JP2017062396A2017-03-30
JP2016508970A2016-03-24
JP2012529558A2012-11-22
JP2011225520A2011-11-10
JP2006265527A2006-10-05
JP2005139298A2005-06-02
JP2013006893A2013-01-10
JPH0251520A1990-02-21
Attorney, Agent or Firm:
GOTO & CO. (2-18, Kobai-cho Kita-ku, Osaka-sh, Osaka 38, 〒5300038, JP)
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