Title:
THERMOSETTING CONDUCTIVE ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2016/140204
Kind Code:
A1
Abstract:
[Problem] Conventional conductive adhesives had difficulty with balancing storage stability and low-temperature curability, and with manifesting adhesive strength and conductivity when used on poorly-adhesive metal adherends such as gold and nickel. In contrast, the present invention provides an isotropic conductive adhesive that has low-temperature curability in an atmosphere of 80-130°C. [Solution] A thermosetting conductive adhesive containing components (A)-(E) such that the content of the component (E) is 100-1000 parts by mass relative to 100 parts by mass of the total content of the component (A) and the component (B). Component (A): a urethane-modified oligomer having a (meth)acrylic group. Component (B): a monomer having 1 (meth)acrylic group intramolecularly. Component (C): an organic peroxide having a specific structure. Component (D): a phosphate ester compound. Component (E): conductive particles surface-treated with stearic acid.
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Inventors:
OTA SOICHI (JP)
MAFUNE HITOSHI (JP)
KATO MAKOTO (JP)
OSADA MASAYUKI (JP)
SUZUKI TAKASHI (JP)
MAFUNE HITOSHI (JP)
KATO MAKOTO (JP)
OSADA MASAYUKI (JP)
SUZUKI TAKASHI (JP)
Application Number:
PCT/JP2016/056135
Publication Date:
September 09, 2016
Filing Date:
February 29, 2016
Export Citation:
Assignee:
THREE BOND CO LTD (JP)
International Classes:
C09J175/14; C09J4/02; C09J9/02; C09J11/04; C09J11/06; C09J171/00; H01B1/00; H01B1/22
Domestic Patent References:
| WO2008062548A1 | 2008-05-29 | |||
| WO2010047200A1 | 2010-04-29 |
Foreign References:
| JP2013028675A | 2013-02-07 | |||
| JPH1095966A | 1998-04-14 | |||
| JP2006257200A | 2006-09-28 | |||
| JP2009277769A | 2009-11-26 | |||
| JP2004269689A | 2004-09-30 |
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
Hatta international patent business corporation (JP)
Hatta international patent business corporation (JP)
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