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Title:
THERMOSETTING EPOXY RESIN COMPOSITION AND PREPREG, LAMINATED BOARD AND PRINTED CIRCUIT BOARD USING THERMOSETTING EPOXY RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/128630
Kind Code:
A1
Abstract:
Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.

Inventors:
CHEN YONG (CN)
XU YONGJING (CN)
TANG GUOFANG (CN)
Application Number:
PCT/CN2020/082466
Publication Date:
July 01, 2021
Filing Date:
March 31, 2020
Export Citation:
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Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08G59/42; B32B15/14; B32B17/02; B32B27/04; C07F9/6571; C07F9/6574; C08J5/24; H05K1/03
Domestic Patent References:
WO2019090563A12019-05-16
WO2018103199A12018-06-14
Foreign References:
CN1350030A2002-05-22
CN108164684A2018-06-15
CN106750183A2017-05-31
US5500285A1996-03-19
CN107383340A2017-11-24
CN102070770A2011-05-25
CN110156959A2019-08-23
US20110172384A12011-07-14
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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