Title:
THERMOSETTING EPOXY RESIN COMPOSITION AND USES THEREOF
Document Type and Number:
WIPO Patent Application WO/2012/029425
Kind Code:
A1
Abstract:
A liquid thermosetting epoxy resin composition which comprises a base resin material, (D) a curing agent, and (E) a cure accelerator, or which comprises a base resin material and (D') a curing catalyst, each base resin material being composed of (A) an alicyclic epoxy compound that has a cyclic aliphatic skeleton and two or more epoxy groups in the molecule, (B) a polyester polyol and/or a polycarbonate polyol, each polyol having two or more terminal hydroxyl groups, and (C) a phosphorous acid ester. The liquid thermosetting epoxy resin composition exhibits excellent viscosity stability, and can yield an excellently heat-resistant and transparent cured product which is homogeneous even when the cured product has a large thickness and which does not crack even under heat cycle conditions.
Inventors:
SAKANE MASANORI (JP)
Application Number:
PCT/JP2011/066433
Publication Date:
March 08, 2012
Filing Date:
July 20, 2011
Export Citation:
Assignee:
DAICEL CHEM (JP)
SAKANE MASANORI (JP)
SAKANE MASANORI (JP)
International Classes:
C08L63/00; C08G59/62; C08K5/524; C08L67/00; C08L69/00; H01L23/29; H01L23/31
Domestic Patent References:
| WO2006064736A1 | 2006-06-22 | |||
| WO2000046317A1 | 2000-08-10 | |||
| WO2006064736A1 | 2006-06-22 |
Foreign References:
| JP2007308683A | 2007-11-29 | |||
| JP2007169337A | 2007-07-05 | |||
| JP2004210932A | 2004-07-29 | |||
| JPH09278869A | 1997-10-28 | |||
| JP2009126974A | 2009-06-11 | |||
| JPH09255764A | 1997-09-30 | |||
| JPH10156952A | 1998-06-16 | |||
| JP2000063485A | 2000-02-29 | |||
| JPH0971636A | 1997-03-18 | |||
| JP2002275169A | 2002-09-25 | |||
| JPS62187725A | 1987-08-17 | |||
| JPH02175721A | 1990-07-09 | |||
| JPH0249025A | 1990-02-19 | |||
| JPH03220233A | 1991-09-27 | |||
| JPH03252420A | 1991-11-11 |
Attorney, Agent or Firm:
GOTO, YUKIHISA (JP)
Yukihisa Goto (JP)
Yukihisa Goto (JP)
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Claims: