Title:
THERMOSETTING EPOXY RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2004/081077
Kind Code:
A1
Abstract:
A thermosetting epoxy resin composition excellent in both storage stability and low-temperature setting properties. The composition comprises (A) an epoxy resin and (B) a powder-coated curing agent wherein a powdery material having a median diameter of 2 μm or below adheres to the surface of a curing agent that is solid at ordinary temperatures at a weight ratio of the solid curing agent to the powdery material of 1 : 0.001 to 0.7 to thereby cover the active groups on the surface with the powdery material. This composition is useful as adhesive, sealing material, coating material, paint, sealant and other moldings.
Inventors:
SAITO ATSUSHI (JP)
OKUNO TATSUYA (JP)
OKUNO TATSUYA (JP)
Application Number:
PCT/JP1996/002808
Publication Date:
September 23, 2004
Filing Date:
September 27, 1996
Export Citation:
Assignee:
SAITO ATSUSHI (JP)
OKUNO TATSUYA (JP)
OKUNO TATSUYA (JP)
International Classes:
C08G59/18; C08K3/00; C08G59/40; C08G59/50; C08K9/02; C08K9/10; C08L63/00; C09D163/00; C09J163/00; (IPC1-7): C08G59/40
Foreign References:
| JPH03122114A | 1991-05-24 | |||
| JPH05123565A | 1993-05-21 | |||
| JPS5883023A | 1983-05-18 | |||
| JPS62103047A | 1987-05-13 | |||
| JPS63223027A | 1988-09-16 |
Attorney, Agent or Firm:
Aoyama, Tamotsu (IMP Building 3-7, Shiromi 1-chome, Chuo-k, Osaka-shi Osaka 540, JP)
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