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Title:
THERMOSETTING PHENOLIC RESIN COMPOSITION OR COMPOUND, OR CARBON COMPOSITE THEREOF
Document Type and Number:
WIPO Patent Application WO/2001/048085
Kind Code:
A1
Abstract:
A thermosetting phenolic resin composition or compound characterized by comprising 10 to 85 wt.% phenolic resin obtained mainly by reacting phenol with formaldehyde and having reactive hydroxymethyl groups and a weight-average molecular weight of 1,000 or higher, 90 to 15 wt.% furfuryl alcohol, and 0 to 17 wt.% hardener; or a carbon composite of the composition or compound. The composition or compound or the composite is effective in improving the strength of an unburned object in producing a carbon-containing refractory or a carbon fiber/carbon composite material. It is effective also in yielding a burned object having an improved carbon yield. Furthermore, it is effective in reducing the amount of gas generation and in lowering gas toxicity.

Inventors:
YOSHINAGA NAOTO (JP)
SHIMIZU TAKEHIRO (JP)
Application Number:
PCT/JP2000/008317
Publication Date:
July 05, 2001
Filing Date:
November 24, 2000
Export Citation:
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Assignee:
KANEBO LTD (JP)
YOSHINAGA NAOTO (JP)
SHIMIZU TAKEHIRO (JP)
International Classes:
C04B35/532; C04B35/83; C08L61/14; (IPC1-7): C08L61/06; C04B35/524; C04B35/83; C08G8/28; C08K5/1535
Foreign References:
JPH06321633A1994-11-22
US3330680A1967-07-11
JPH09292714A1997-11-11
JPH08283531A1996-10-29
JPS6474211A1989-03-20
JPH06322103A1994-11-22
JPS564646A1981-01-19
JPH06263523A1994-09-20
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