THERMOSETTING RESIN COMPOSITION AND ADHESIVE FILMS

WIPO Patent Application WO/2003/082947

A1

A thermosetting resin composition comprising the following components (A) and (B); an adhesive comprising the thermosetting resin composition and an organic solvent and/or water; and adhesive films comprising the thermosetting resin composition: (A) at least one phenolic resin selected from the group consisting of alkylphenolic novolaks, adducts of aliphatic polymers having double bonds with phenol, and adducts of alicyclic polymers having double bonds with phenol, and (B) an epoxy-containing ethylenic copolymer obtained by polymerizing the components (b₁) and (b₂): (b₁) ethylene and/or propylene, and (b₂) a monomer represented by the general formula (1): (1) wherein R is a hydrocarbon group having 2 to 18 carbon atoms and a double bond, at least one hydrogen atom of which group may be replaced by halogen, hydroxyl, or carboxyl; and X is a single bond or carbonyl.

FUJIKI TORU (JP)
MORI TOSHIKI (JP)
IYAMA HIRONOBU (JP)
NAITOH SHIGEKI (JP)

PCT/JP2003/003702

October 09, 2003

March 26, 2003

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SUMITOMO CHEMICAL CO (JP)
FUJIKI TORU (JP)
MORI TOSHIKI (JP)
IYAMA HIRONOBU (JP)
NAITOH SHIGEKI (JP)

C08L63/00; C08L15/00; C08L61/06; C08L61/08; C08L65/00; C09J7/10; C09J7/35; C09J123/02; C09J161/06; C09J163/00; (IPC1-7): C08G59/62; C08L63/00; C09J163/00; C08J7/00

WO2002000756A1

2002-01-03

JPS53126053A	1978-11-02
JPH0820710A	1996-01-23
JPH08169936A	1996-07-02
JP2002249551A	2002-09-06
JP2003137969A	2003-05-14

Enomoto, Masayuki c/o Sumitomo Chemical Intellectual Property Service (Limited 5-33 Kitahama 4-chom, Chuo-ku Osaka-shi Osaka, JP)

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