Title:
THERMOSETTING RESIN COMPOSITION, COVERLAY FILM, ADHESIVE SHEET, AND FLEXIBLE PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2023/067662
Kind Code:
A1
Abstract:
This thermosetting resin composition contains: an epoxy resin that is solid at 25°C; an epoxy resin that is non-solid at 25°C; a finely particulate rubber that is dispersed in the non-solid epoxy resin; a setting agent; an inorganic filler; and a polyurethane derived from a polycarbonate diol. The finely particulate rubber is contained at a quantity of 3-15 parts by mass relative to the total parts by mass of the solid epoxy resin and the non-solid epoxy resin. The acid value of the polyurethane derived from the polycarbonate diol is 10-30 mg KOH/g. The weight average molecular weight of the polyurethane derived from the polycarbonate diol is 15,000-60,000.
Inventors:
GONDAIRA TAKASHI (JP)
FURUKAWA KATSUHIKO (JP)
MOROHASHI TOSHIKI (JP)
ISHIKAWA YUKI (JP)
FURUKAWA KATSUHIKO (JP)
MOROHASHI TOSHIKI (JP)
ISHIKAWA YUKI (JP)
Application Number:
PCT/JP2021/038486
Publication Date:
April 27, 2023
Filing Date:
October 18, 2021
Export Citation:
Assignee:
ARISAWA SEISAKUSHO KK (JP)
International Classes:
C09J11/04; C08G18/44; C08K3/013; C08L51/04; C08L63/00; C08L75/06; C09J7/30; C09J11/06; C09J11/08; C09J163/00; C09J175/06
Foreign References:
| JP2007204715A | 2007-08-16 | |||
| JP2009096940A | 2009-05-07 | |||
| JP2013176965A | 2013-09-09 |
Attorney, Agent or Firm:
KIMURA Mitsuru et al. (JP)
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