Title:
THERMOSETTING RESIN COMPOSITION, CURED FILM, SUBSTRATE WITH CURING FILM, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2015/012395
Kind Code:
A1
Abstract:
The present invention pertains to a thermosetting resin composition, a cured film, a substrate with a cured film, and an electronic component, said thermosetting resin composition containing a poly(ester amide) acid (A), an epoxy compound having a fluorene skeleton (B), and an epoxy curing agent (C).
Inventors:
FURUTA TOMOTSUGU (JP)
MOROKOSHI SHINTA (JP)
KIKUCHI AYAKO (JP)
MOROKOSHI SHINTA (JP)
KIKUCHI AYAKO (JP)
Application Number:
PCT/JP2014/069722
Publication Date:
January 29, 2015
Filing Date:
July 25, 2014
Export Citation:
Assignee:
JNC CORP (JP)
International Classes:
C08L63/00; C08G59/42; C08K5/09; C08L79/08; H05K1/03; H05K3/28
Domestic Patent References:
| WO2013054868A1 | 2013-04-18 |
Foreign References:
| JP2005105264A | 2005-04-21 | |||
| JP2008156546A | 2008-07-10 | |||
| JP2012163339A | 2012-08-30 | |||
| JP2009052023A | 2009-03-12 | |||
| JP2009122478A | 2009-06-04 | |||
| JPH05148411A | 1993-06-15 | |||
| JPH05148410A | 1993-06-15 | |||
| JP2004035821A | 2004-02-05 | |||
| JPH09328534A | 1997-12-22 | |||
| JPH04323216A | 1992-11-12 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
Patent business corporation SSINPAT (JP)
Patent business corporation SSINPAT (JP)
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