Title:
THERMOSETTING RESIN COMPOSITION, CURED FILM, SUBSTRATE HAVING CURED FILM, ELECTRONIC COMPONENT, AND INK COMPOSITION FOR INKJET
Document Type and Number:
WIPO Patent Application WO/2018/159675
Kind Code:
A1
Abstract:
In order to be capable of forming a cured product having superior adhesion to a substrate, flux resistance, solder resistance, and solvent resistance, and in order to enable temporal curing, this thermosetting resin composition contains a polyester amide acid (A), an epoxy compound (B) having a weight-average molecular weight of less than 10,000, a copolymer (C) having oxiranyl or oxetanyl, a solvent (D), a coloring agent (E), a (meth)acrylate (G) having three or more functional groups, and a polymerization initiator (H).
Inventors:
MOROKOSHI SHINTA (JP)
FURUTA TOMOTSUGU (JP)
TAKAHASHI TOSHIYUKI (JP)
FURUTA TOMOTSUGU (JP)
TAKAHASHI TOSHIYUKI (JP)
Application Number:
PCT/JP2018/007499
Publication Date:
September 07, 2018
Filing Date:
February 28, 2018
Export Citation:
Assignee:
JNC CORP (JP)
International Classes:
C08G59/40; B41J2/01; B41M5/00; C08G73/10; C08K3/00; C08L63/00; C09D11/30; H05K3/28
Domestic Patent References:
WO1996011239A1 | 1996-04-18 | |||
WO2015068703A1 | 2015-05-14 |
Foreign References:
JP2015081336A | 2015-04-27 | |||
JP2016103010A | 2016-06-02 | |||
JP2014169353A | 2014-09-18 |
Attorney, Agent or Firm:
OKUBO, Katsuyuki (JP)
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