Title:
THERMOSETTING RESIN COMPOSITION, CURED FILM OF SAME, LAMINATE, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2019/013241
Kind Code:
A1
Abstract:
Provided is a novel thermosetting resin composition with which it is possible to contribute to an increased abundance of materials. Provided are, in particular, a thermosetting resin composition which is stable, and which has excellent strength in the form of a cured film, in addition to a cured film thereof, a laminate, a semiconductor device and a method for producing same. The thermosetting resin composition contains: a polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor; at least one of a compound having cations represented by formula (B1), a compound having anions represented by formula (B2), and a compound represented by formula (B3); and a solvent. The compound having cations represented by formula (B1) and the compound having anions represented by formula (B2) may form a salt, and may have different counterions.
Inventors:
YOSHIDA KENTA (JP)
KAWABATA TAKESHI (JP)
IWAI YU (JP)
SHIBUYA AKINORI (JP)
KAWABATA TAKESHI (JP)
IWAI YU (JP)
SHIBUYA AKINORI (JP)
Application Number:
PCT/JP2018/026135
Publication Date:
January 17, 2019
Filing Date:
July 11, 2018
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08G73/10; B32B15/08; B32B27/00; B32B27/34; C08K5/17; C08K5/3435; C08K5/42; C08L79/08; H01L23/12
Domestic Patent References:
| WO2017104672A1 | 2017-06-22 |
Foreign References:
| JP2015108053A | 2015-06-11 | |||
| JP2005068219A | 2005-03-17 | |||
| JP2015178541A | 2015-10-08 | |||
| JP2014071374A | 2014-04-21 | |||
| JPH10168188A | 1998-06-23 | |||
| JPH08143664A | 1996-06-04 | |||
| JP2007056196A | 2007-03-08 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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