Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, ACTIVE ESTER RESIN, SEMICONDUCTOR SEALING MATERIAL, PREPREG, PRINTED CIRCUIT BOARD, AND BUILD-UP FILM
Document Type and Number:
WIPO Patent Application WO/2012/002119
Kind Code:
A1
Abstract:
Provided are a thermosetting resin composition and a cured product thereof having both excellent heat resistance and flame resistance while also having a low dielectric constant and low dielectric tangent, and also provided are an active ester resin that causes these properties to manifest, and a semiconductor sealing material, prepreg, printed circuit board, and build-up film obtained from the composition. The essential components are active ester resin (A) and epoxy resin (B). The active ester resin has a resin structure comprising a polyaryleneoxy structure (I) and a structural unit (II) which is represented by structural formula 1 and links multiple aromatic carbon atoms in the structure (I) (where Ar is a phenylene group, a phenylene group in which the nucleus has been substituted by one to three C1-4 alkyl groups, a naphthylene group, or a naphthylene group in which the nucleus has been substituted by one to three C1-4 alkyl groups).

More Like This:
JP2002060467THERMOSETTING RESIN COMPOSITION AND ITS CURED ITEM
JP06192397CURING AGENT FOR EPOXY RESIN
JP04251715MANUFACTURE OF CARBON FIBER REINFORCED COMPOSITE MATERIAL
Inventors:
ARITA Kazuo (Chiba Plant 12, Yawata-kaigandori, Ichihara-sh, Chiba 85, 〒2908585, JP)
有田　和郎 (〒85 千葉県市原市八幡海岸通１２番地　ＤＩＣ株式会社　千葉工場内 Chiba, 〒2908585, JP)
Application Number:
JP2011/063141
Publication Date:
January 05, 2012
Filing Date:
June 08, 2011
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DIC Corporation (35-58, Sakashita 3-chome Itabashi-k, Tokyo 20, 〒1748520, JP)
ＤＩＣ株式会社 (〒20 東京都板橋区坂下三丁目３５番５８号 Tokyo, 〒1748520, JP)
ARITA Kazuo (Chiba Plant 12, Yawata-kaigandori, Ichihara-sh, Chiba 85, 〒2908585, JP)
International Classes:
C08L63/00; C08G59/62; C08J5/24; H01B3/40; H05K1/03
Attorney, Agent or Firm:
KONO Michihiro (7-20 Nihonbashi 3-chome, Chuo-k, Tokyo 33, 〒1038233, JP)
Download PDF:
View/Download PDF      PDF Help
Claims:



 
Previous Patent: DIELECTRIC CERAMIC MATERIAL AND LAMINATED CERAMIC CAPACITOR COMPRISING SAME

Next Patent: LEAD-FREE LOW MELTING POINT GLASS COMPOSITION