THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, AND INTERLAYER ADHESIVE FILM FOR PRINTED WIRING BOARD

WIPO Patent Application WO/2012/105558

A1

Provided are: a thermosetting polyimide resin composition that has excellent dimensional stability when cured, excellent low-temperature solubility when semi-cured (transitioned to the B-stage), and excellent fire resistance after being cured completely; a cured product of said composition; and an interlayer adhesive film for a printed wiring board obtained from the thermosetting polyimide resin composition. Specifically provided are: the thermosetting polyimide resin composition including a thermosetting polyimide resin (A) that has a biphenyl skelton that connects directly to the nitrogen atom of a five-membered ring imide skeleton and has a weighted average molecular weight (Mw) of 3,000 to 150,000, a phosphorus compound (B) that is represented by a prescribed general formula (b1) or (b2), and an epoxy resin (C); a cured product of the said composition; and an interlayer adhesive film for a printed wiring board that has, on a carrier film, a layer formed from the thermosetting polyimide resin composition.

MURAKAMI KOUICHI (JP)
ICHINOSE EIJYU (JP)
MIYAGAKI ATSUSHI (JP)
MIHARA TAKASHI (JP)
HAZAMA MASAKI (JP)

PCT/JP2012/052144

August 09, 2012

January 31, 2012

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DAINIPPON INK & CHEMICALS (JP)
MURAKAMI KOUICHI (JP)
ICHINOSE EIJYU (JP)
MIYAGAKI ATSUSHI (JP)
MIHARA TAKASHI (JP)
HAZAMA MASAKI (JP)

C08L63/00; C08G59/40; C08K5/53; C08L79/08; C09J7/35; C09J11/06; C09J163/00; C09J179/08; H05K1/03

WO2010098296A1

2010-09-02

JP2007224242A	2007-09-06
JP2010043254A	2010-02-25
JP2012072298A	2012-04-12
JP2004168894A	2004-06-17
JP2000223805A	2000-08-11

KONO MICHIHIRO (JP)
Michihiro Kono (JP)

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