Title:
THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, AND ELECTRIC/ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2015/115186
Kind Code:
A1
Abstract:
A thermosetting resin composition containing (a) a polyfunctional (meth)acrylate, (b) a high-thermal-conductivity filler having a thermal conductivity of 20-250 W/m∙K, (c) a curing agent, and (d) a copolymer having an acid group containing phosphoric acid, the thermosetting resin composition characterized in that the content of the high-thermal-conductivity filler (b) is 1600-2100 parts by mass with respect to 100 parts by mass of the polyfunctional (meth)acrylate (a), and the content of the copolymer having an acid group containing phosphoric acid (d) is 7.5-30 parts by mass with respect to 100 parts by mass of the polyfunctional (meth)acrylate (a).
Inventors:
ISHIUCHI RYUJIN (JP)
ITAMI SHOTARO (JP)
FUJITA HIDEKAZU (JP)
ITAMI SHOTARO (JP)
FUJITA HIDEKAZU (JP)
Application Number:
PCT/JP2015/050895
Publication Date:
August 06, 2015
Filing Date:
January 15, 2015
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
International Classes:
C08F290/06; C08F2/44; C08F283/02
Foreign References:
| JP2010280746A | 2010-12-16 | |||
| JP2000053731A | 2000-02-22 | |||
| JP2005248019A | 2005-09-15 | |||
| JPS62199640A | 1987-09-03 | |||
| JP2010280746A | 2010-12-16 |
Other References:
See also references of EP 3101042A4
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
Masatake Shiga (JP)
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