Title:
THERMOSETTING RESIN COMPOSITION, RESIN CURED PRODUCT AND COMPOSITE MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2023/189030
Kind Code:
A1
Abstract:
The present invention provides a thermosetting resin composition which is capable of suppressing the generation of a void space between a sheet and an adherend that has a roughened surface even if pressing is performed with a low pressure when the sheet is adhered to the adherend by pressurized pressing. The present invention provides a thermosetting resin composition which contains an epoxy resin as a main component resin, while containing boron nitride agglomerated particles as an inorganic filler. This thermosetting resin composition is characterized in that: the proportion of the boron nitride agglomerated particles in the resin composition is 40% by volume to 50% by volume; and the proportion of inorganic fillers other than the boron nitride agglomerated particles in the resin composition is 7% by volume or less.
More Like This:
Inventors:
KIMURA AKINORI (JP)
TANAKA TOSHIYUKI (JP)
TANAKA TOSHIYUKI (JP)
Application Number:
PCT/JP2023/006385
Publication Date:
October 05, 2023
Filing Date:
February 22, 2023
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08G59/00; B32B15/092; B32B15/20; B32B27/20; B32B27/38; C08K3/38; C08L63/00; H01L23/29; H01L23/31; H01L23/36; H01L23/373
Domestic Patent References:
| WO2021085593A1 | 2021-05-06 |
Foreign References:
| JP2017082091A | 2017-05-18 | |||
| JP2009024126A | 2009-02-05 | |||
| JP2015196823A | 2015-11-09 | |||
| JP2019029269A | 2019-02-21 |
Attorney, Agent or Firm:
ICHIZAWA, KAWADA & ASSOCIATES (JP)
Download PDF:
Previous Patent: VEHICLE BODY STRUCTURE, AND METHOD FOR DESIGNING VEHICLE BODY STRUCTURE
Next Patent: DRIVING APPARATUS
Next Patent: DRIVING APPARATUS